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Shenzhen Rio Tinto Electronic Equipment Co., Ltd., electronic assembly equipment

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The importance of lateral temperature difference and heating rate of reflow soldering!

Date: 2015/1/17 12:40

Characteristics of temperature curve Lead-based solder Lead-free solder, average heating rate (Tsmax to Tp) up to 3 ° C / s up to 3 ° C / s, preheating: minimum temperature (Tsmin) 100 ° C 150 ° C, preheating: highest Temperature (Tsmax) 150 ° C 200 ° C, preheating: time (tsmin to tsmax) 60-120 seconds 60-180 seconds, time to maintain above temperature: temperature (TL) 183 ° C 217 ° C, maintain above Time for temperature: time (tL) 60-150 seconds 60-150 seconds, peak / class temperature (Tp) 215 ° C 260 ° C.




The micro-circulation air transport system and the principle of pressurized multi-point jet ensure uniform temperature in the furnace, good anisotropy in each temperature zone, and the board surface does not generate heated empty areas due to refraction when heated, no shadows, and PCB surface Horizontal △ T <± 2 ℃, which fundamentally improves the heating efficiency, fast and efficient thermal compensation performance, the difference between the actual temperature of the soldering zone pcb and the set temperature is less than 3 ℃, especially suitable for bga, csp, qfp and other components and multilayer Perfect soldering of circuit boards. The temperature setting of the two adjacent temperature zones can reach 100 ° C, and the temperature difference between the upper and lower sides of the pcb can reach 60 ° C, which can fully meet the reliable welding of the two panels. The patented guide rail does not deform at high temperature, which effectively guarantees the guide rails to be parallel, prevents the board from falling off, and prevents the occurrence of jamming, free cleaning, and easy adjustment. Automatic and manual width adjustment. <>


Lateral temperature deviation of different series of Rio Tinto reflow soldering:

: 裸板FR4板材测试: PCB板面横向△T<±3℃<> S series (mesh belt type) : bare board FR4 board test: PCB board surface transverse △ T <± 3 ℃ <>

: 裸板FR4板材测试: PCB板面横向△T<±2℃<> ES series (mesh belt type) : bare board FR4 plate test: PCB board surface transverse △ T <± 2 ℃ <>

: 裸板FR4板材测试: PCB板面横向△T<±1.5℃ 适用BGA焊接 M series (mesh belt type) : bare board FR4 plate test: PCB board surface transverse △ T <± 1.5 ℃ suitable for BGA welding

系列(导轨+网带型): 裸板FR4板材测试: PCB板面横向△T<±1.5℃ 适用BGA焊接 MS series (rail + mesh belt type): bare board FR4 plate test: PCB board surface transverse △ T <± 1.5 ℃ suitable for BGA welding

系列(导轨+网带型): 裸板FR4板材测试: PCB板面横向△T<±1℃ 适用大容量BGA焊接 RS series (rail + mesh belt type): bare board FR4 plate test: PCB board surface transverse △ T <± 1 ℃ suitable for large capacity BGA welding

系列研发型(导轨+网带型): 裸板FR4板材测试: PCB板面横向△T<±0.5℃ 适用大容量 BGA焊接 RS series research and development type (rail + mesh belt type): bare board FR4 plate test: PCB board surface transverse △ T <± 0.5 ℃ suitable for large capacity BGA welding

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